{
  "_hinweis": "Quelle der Wahrheit für den ausklappbaren Verzweigungs-Baum in Google-Rechenzentrum/index.html. Beim Ändern HTML und JSON synchron halten. phase = Phasen-Nummer 0-6, engpass = hoch|mittel|niedrig|-, link = relativer Pfad zum bestehenden Buch (optional).",
  "_stand": "2026-05-20",
  "name": "Google-Rechenzentrum",
  "role": "Betreiber & Senke der Kette",
  "phase": 0,
  "engpass": "-",
  "children": [
    {
      "name": "KI-Beschleuniger (Compute)",
      "role": "Rechenleistung für Training & Inferenz",
      "phase": 1,
      "engpass": "hoch",
      "children": [
        {
          "name": "Nvidia GPU",
          "role": "zugekaufter Beschleuniger",
          "phase": 1,
          "engpass": "hoch",
          "children": [
            {
              "name": "Nvidia (Chip-Design, fabless)",
              "role": "entwirft den Chip, fertigt nicht selbst",
              "phase": 2,
              "engpass": "mittel",
              "children": [
                { "name": "Arm", "role": "Prozessor-IP / Instruktionssatz", "phase": 2, "engpass": "mittel" },
                { "name": "Synopsys / Cadence", "role": "EDA-Design-Software", "phase": 2, "engpass": "mittel" }
              ]
            },
            {
              "name": "TSMC",
              "role": "Foundry: fertigt den GPU-Wafer",
              "phase": 3,
              "engpass": "hoch",
              "children": [
                {
                  "name": "Advanced Packaging (CoWoS)",
                  "role": "stapelt Logik + HBM",
                  "phase": 3,
                  "engpass": "hoch",
                  "children": [
                    { "name": "TSMC / Amkor / ASE", "role": "Packaging-/OSAT-Kapazität", "phase": 3, "engpass": "hoch" }
                  ]
                },
                {
                  "name": "Halbleiter-Equipment (WFE)",
                  "role": "Maschinen der Fab",
                  "phase": 4,
                  "engpass": "hoch",
                  "children": [
                    {
                      "name": "ASML",
                      "role": "EUV-Lithografie (Monopol)",
                      "phase": 4,
                      "engpass": "hoch",
                      "link": "../../Arbeitsspeicher/Lieferkette/ASML/index.html",
                      "children": [
                        { "name": "Carl Zeiss SMT", "role": "EUV-Optik (Single-Source an ASML)", "phase": 5, "engpass": "hoch" },
                        { "name": "TRUMPF", "role": "CO₂-Treiberlaser für EUV", "phase": 5, "engpass": "hoch" },
                        { "name": "Cymer (ASML)", "role": "EUV-Lichtquelle", "phase": 5, "engpass": "hoch" }
                      ]
                    },
                    { "name": "Applied Materials", "role": "Deposition / Etch / Implant", "phase": 4, "engpass": "mittel", "link": "../../Arbeitsspeicher/Lieferkette/Applied-Materials/index.html" },
                    { "name": "Lam Research", "role": "Etch & Deposition", "phase": 4, "engpass": "mittel", "link": "../../Arbeitsspeicher/Lieferkette/Lam-Research/index.html" },
                    { "name": "Tokyo Electron", "role": "Coater/Developer-Track, Etch", "phase": 4, "engpass": "hoch", "link": "../../Arbeitsspeicher/Lieferkette/Tokyo-Electron/index.html" },
                    { "name": "KLA", "role": "Prozesskontrolle / Metrologie", "phase": 4, "engpass": "mittel", "link": "../../Arbeitsspeicher/Lieferkette/KLA/index.html" },
                    { "name": "Advantest / Teradyne", "role": "Test (SoC / Memory)", "phase": 4, "engpass": "mittel", "link": "../../Arbeitsspeicher/Lieferkette/Advantest/index.html" }
                  ]
                },
                {
                  "name": "Materialien & Chemie",
                  "role": "Verbrauchsstoffe der Fab",
                  "phase": 5,
                  "engpass": "hoch",
                  "children": [
                    { "name": "Shin-Etsu / SUMCO / GlobalWafers", "role": "Silizium-Wafer", "phase": 5, "engpass": "mittel", "link": "../../Arbeitsspeicher/Lieferkette/Shin-Etsu/index.html" },
                    { "name": "JSR / Tokyo Ohka / Shin-Etsu", "role": "Photoresist (EUV)", "phase": 5, "engpass": "hoch" },
                    { "name": "Linde / Air Liquide / Air Products", "role": "Industrie- & Spezialgase", "phase": 5, "engpass": "mittel", "link": "../../Arbeitsspeicher/Lieferkette/Linde/index.html" },
                    { "name": "Entegris", "role": "Filtration / Materialhandling / CMP", "phase": 5, "engpass": "mittel", "link": "../../Arbeitsspeicher/Lieferkette/Entegris/index.html" }
                  ]
                },
                {
                  "name": "Rohstoffe & Energie",
                  "role": "tiefste Ebene der Kette",
                  "phase": 6,
                  "engpass": "mittel",
                  "children": [
                    { "name": "Polysilicium / hochreiner Quarz", "role": "Wafer-Grundstoff & Tiegel", "phase": 6, "engpass": "mittel" },
                    { "name": "Neon / Edelgase", "role": "für Litho-Laser", "phase": 6, "engpass": "mittel" },
                    { "name": "Kupfer / Gold / Seltene Erden", "role": "Verdrahtung & Komponenten", "phase": 6, "engpass": "niedrig" },
                    { "name": "Strom / Energie", "role": "für Fabs und das Rechenzentrum", "phase": 6, "engpass": "mittel" }
                  ]
                }
              ]
            },
            {
              "name": "HBM-Speicher",
              "role": "High-Bandwidth Memory am Beschleuniger",
              "phase": 3,
              "engpass": "hoch",
              "note": "Wird in Memory-Fabs gefertigt und bei TSMC mit der Logik gepackt (CoWoS) - nutzt dieselbe Equipment-/Material-Kette wie der TSMC-Pfad.",
              "children": [
                { "name": "SK Hynix / Micron / Samsung", "role": "HBM-Hersteller", "phase": 3, "engpass": "hoch", "link": "../../Arbeitsspeicher/Micron/index.html" }
              ]
            }
          ]
        },
        {
          "name": "Google TPU (eigener Chip)",
          "role": "Googles selbst entworfener KI-Beschleuniger",
          "phase": 1,
          "engpass": "hoch",
          "children": [
            { "name": "Google (Architektur)", "role": "entwirft die TPU-Architektur in-house", "phase": 2, "engpass": "-" },
            {
              "name": "Broadcom (Co-Design / ASIC)",
              "role": "übersetzt die Architektur in Silizium, managt Fertigung & Packaging; ab v8 zusätzlich MediaTek",
              "phase": 2,
              "engpass": "hoch",
              "children": [
                { "name": "Arm-IP / SerDes-IP", "role": "Bausteine & Schnittstellen", "phase": 2, "engpass": "mittel" }
              ]
            },
            { "name": "TSMC", "role": "Fertigung (Ironwood/v7 auf 3 nm) - siehe TSMC-Pfad oben", "phase": 3, "engpass": "hoch" },
            { "name": "SK Hynix / Micron / Samsung", "role": "HBM am TPU", "phase": 3, "engpass": "hoch", "link": "../../Arbeitsspeicher/Micron/index.html" }
          ]
        },
        {
          "name": "AMD Instinct GPU",
          "role": "alternativer Beschleuniger",
          "phase": 1,
          "engpass": "mittel",
          "children": [
            { "name": "AMD (fabless) -> TSMC", "role": "Design AMD, Fertigung TSMC - siehe TSMC-Pfad", "phase": 3, "engpass": "hoch" }
          ]
        }
      ]
    },
    {
      "name": "CPUs (Hauptprozessoren)",
      "role": "Server-Steuerung",
      "phase": 1,
      "engpass": "niedrig",
      "children": [
        { "name": "Google Axion (Arm, eigen)", "role": "eigener Arm-Server-Chip; Fertigung TSMC 3 nm", "phase": 1, "engpass": "-" },
        { "name": "AMD EPYC / Intel Xeon", "role": "zugekaufte x86-CPUs", "phase": 1, "engpass": "niedrig" }
      ]
    },
    {
      "name": "Speicher & Storage",
      "role": "Arbeitsspeicher & Datenspeicher",
      "phase": 1,
      "engpass": "hoch",
      "children": [
        { "name": "HBM (SK Hynix / Micron / Samsung)", "role": "High-Bandwidth Memory", "phase": 1, "engpass": "hoch", "link": "../../Arbeitsspeicher/index.html" },
        { "name": "DDR5-DRAM-Module", "role": "Server-Arbeitsspeicher", "phase": 1, "engpass": "mittel" },
        { "name": "NAND-SSD (Micron / SanDisk / Kioxia / Samsung)", "role": "Datenspeicher", "phase": 1, "engpass": "niedrig" }
      ]
    },
    {
      "name": "Netzwerk & Switching",
      "role": "verbindet zehntausende Chips",
      "phase": 1,
      "engpass": "hoch",
      "children": [
        { "name": "Broadcom (Tomahawk / Jericho)", "role": "Switch-ASICs", "phase": 1, "engpass": "hoch" },
        { "name": "Nvidia Networking", "role": "NVLink / InfiniBand / Spectrum", "phase": 1, "engpass": "mittel" },
        { "name": "Arista / Cisco", "role": "Switches & Systeme", "phase": 1, "engpass": "niedrig" },
        { "name": "Coherent / Lumentum / Marvell / InnoLight", "role": "optische Transceiver", "phase": 1, "engpass": "hoch" }
      ]
    },
    {
      "name": "Server- & Rack-Integration (ODM)",
      "role": "baut die fertigen Server",
      "phase": 1,
      "engpass": "mittel",
      "children": [
        { "name": "Foxconn / Quanta / Wiwynn / Celestica / Jabil", "role": "Auftragsfertiger (ODM/EMS)", "phase": 1, "engpass": "mittel" },
        { "name": "Mainboards / PCB / Spannungswandler / Stecker", "role": "Baugruppen", "phase": 1, "engpass": "niedrig" }
      ]
    },
    {
      "name": "Stromversorgung",
      "role": "Energie ins Rack",
      "phase": 1,
      "engpass": "mittel",
      "children": [
        { "name": "Vertiv / Schneider Electric / Eaton", "role": "USV, PDU, Transformatoren", "phase": 1, "engpass": "mittel" },
        { "name": "Cummins / Caterpillar", "role": "Notstrom-Generatoren", "phase": 1, "engpass": "niedrig" },
        { "name": "Netzanschluss & Strombezug (PPA, Versorger)", "role": "verbindet zur Energie-Ebene (Phase 6)", "phase": 1, "engpass": "mittel" }
      ]
    },
    {
      "name": "Kühlung",
      "role": "führt Abwärme ab",
      "phase": 1,
      "engpass": "mittel",
      "children": [
        { "name": "Vertiv / CoolIT / Boyd", "role": "Luft- & Flüssigkühlung, CDUs", "phase": 1, "engpass": "mittel" }
      ]
    },
    {
      "name": "Gebäude & Bau",
      "role": "die Hülle des Rechenzentrums",
      "phase": 1,
      "engpass": "niedrig",
      "children": [
        { "name": "Bauunternehmen / Beton / Stahl / Grundstück", "role": "Rohbau & Infrastruktur", "phase": 1, "engpass": "niedrig" }
      ]
    }
  ]
}